R&D Hardware Design Manager

Keysightis at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn moreabout what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions.We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

A major success factor for Keysight continues to be the development and deployment of breakthrough digital, analog, and mixed signal Application Specific Integrated Circuits (ASICs), modules, and subsystems that drive the performance, differentiation, and value of new products. We have an exciting opportunity for a highly motivated R&D Hardware Design Manager to lead our ASIC Packaging, Subsystem, and Integration team. In this role, you will lead the design and integration of high-performance integrated circuit packaging and subsystem solutions for the world's highest performance test and measurement products including Oscilloscopes, Signal Generators, Bit-Error Rate Testers, and Frequency-Domain Instruments.

This position is located in our office in Colorado Springs, Colorado at the base of Pikes Peak. Our beautiful development campus includes both office and advanced technology, assembly & machining facilities, as well as an 18-hole disc golf course, volleyball/basketball courts, a complete fitness center, and cafeteria. Our city is consistently rated as one of the best places to live in the United States. We enjoy bountiful outdoor access, year-round recreational opportunities, and over 300 days of sunshine per year.

You'll collaborate across global teams to design, optimize, and implement ASIC packaging and subsystem solutions that meet test & measurement product functionality, performance, quality and schedule requirements. This role is part of Keysight Laboratories, a world-renowned technology organization which enables Keysight to be first to market with breakthrough products and solutions.

Key Responsibilities include:

• Management of ASIC Package/Subsystem development and system integration including package design and layout, PCB implementation, RF and high-speed digital design, signal integrity modeling, power integrity analysis, and thermostructural analysis
• Close collaboration with system, IC design and test teams to drive hardware architecture, requirements, functionality, and performance
• Identification of appropriate technology solutions for each chip design
• Delivery of electrical models to optimize the IC, package, and system interconnect performance
• Support for instrument development to enable hardware deployment and integration of critical ASIC blocks
• Investigation of next generation technologies and industry solutions
• Collaboration with supply chain partners throughout the ASIC development cycle
• Work closely with internal and external manufacturing partners to identify, develop, deploy, and execute new processes
• Partner with the reliability team in the characterization and qualification of each ASIC

This is a key role requiring a combination of technical and managerial skills.

• BS or MS degree in a relevant Engineering discipline
• Minimum 8+ years of experience in hardware/circuit design, RF/microwave design, high-frequency modeling/optimization, or high-power density design
• Minimum 5 years of experience managing/leading multi-disciplinary development teams
• Proven experience with semiconductor, packaging, and printed circuit board technologies, associated materials, manufacturing processes, and design methodologies.
• Excellent understanding of Electrical Engineering principles, RF/Microwave theory, and high frequency circuit design methodologies.
• Strong knowledge of thermodynamics and thermostructural analysis principles.
• Excellent understanding of materials science principles.
• Familiarity with IC design methodologies, processes, and workflows preferred.

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