BGA Repair

Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporation provides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors. Sanmina Corporation has facilities strategically located in key regions throughout the world.

BGA Repair Technician

Job Purpose:

The Senior Electronic Assembler/BGA Repair Technician will assemble Circuit Card Assemblies using Bill of Material, Drawing and Work Instructions. The position requires advanced soldering skills with the ability to repair complex defects and apply intricate ECO rework. The candidate must have a Ball Grid Array (BGA) removal and replacement experience; Including BGA removal, site prep, solder application, BGA place and reflow. The candidate will need to be able to determine the correct BGA nozzle, stencil, and rework profile. Identify temperature sensitive components or parts (Fiber optics, plastic connectors, batteries, etc.) Must have experience with solder paste printing, reflow soldering, and component placement machine. Candidate will utilize X-ray images and visual inspections to validate work for acceptance

Nature of Duties:

• Knowledge of IPC 610 and J-Standards and the classes with current Certified or have been Certified in the past three years.
• Ability to read and understand English documents, drawings, BOM's, work and ECO Instructions
• Follow procedures (SOP's) and documentation
• In-depth understanding of Surface-Mount Technology (SMT) including electronic components package types and SMT assembly process.
• Be able to hand solder components sizes down to 0201 packages.
• Be able to use tools and systems including: BGA rework station, solder station, electric screwdrivers, torque screwdrivers, wire strippers, pliers, etc.
• Must have the ability to assemble products or sub-assemblies according to verbal or written instructions, or by following drawings or diagrams.
• Able to repair damaged circuits, lands, surface mount pads, including defects in the base board and mask surface.
• Must have micro scope soldering and component rework skills and an understanding of repair/rework processes.
• We require a high degree of quality workmanship (IPC 610 class 3 and above).
• Willingness and experience in working in a fast paced environment and adaptable to changes in priorities.
• This position may require standing for long periods of time (SMT line operator).
• Capable of walking 200 feet several times a day to wash circuit cards
• Lift 25 lbs or more several times a day.
• Willing to work overtime as needed
• Other duties as required

Education and Experience Requirements:

• High school diploma or higher
• 3 years of BGA removal and replace experience
• Former or current IPC soldering certification
• Experience handling and reworking of RF components
• Knowledge of materials, tooling, and mechanical assembly skills for electronic Telecom products
• Microscope and miniature microelectronic assembly skills
• Ability to follow oral and written guidelines or drawings and accurately and concisely communicate testing results
• Excellent communication skills (both verbal and written)
• Fine Dexterity Skills
• Average computer skills
• Has willingness to learn, takes initiative, and offers improvement ideas

Sanmina is an Equal Opportunity Employer - M/F/Veteran/Disability/Sexual Orientation/Gender Identity.

This is an ITAR facility and applicant must be a US Citizen or a lawful permanent resident.